Infineon Technologies H6N Hoja de datos

No.	parte #	Fabricante	Descripción
1	IPSH6N03LB	Infineon Technologies	OptiMOS2 Power-Transistor J-STD20 and JESD22 Rev. 0.3 page 1 2006-05-15 www.DataSheet.in IPUH6N03LB Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area
2	IPUH6N03LAG	Infineon Technologies	Power-Transistor • Ideal for high-frequency dc/dc converters • Qualified according to JEDEC1) for target application • N-channel, logic level • Excellent gate charge x R DS(on) product (FOM) • Superior thermal resistance • 175 °C operating temperature • Pb-free lead
3	IPFH6N03LAG	Infineon Technologies	Power-Transistor • Ideal for high-frequency dc/dc converters • Qualified according to JEDEC1) for target application • N-channel, logic level • Excellent gate charge x R DS(on) product (FOM) • Superior thermal resistance • 175 °C operating temperature • Pb-free lead
4	IPSH6N03LAG	Infineon Technologies	Power-Transistor • Ideal for high-frequency dc/dc converters • Qualified according to JEDEC1) for target application • N-channel, logic level • Excellent gate charge x R DS(on) product (FOM) • Superior thermal resistance • 175 °C operating temperature • Pb-free lead
5	IPDH6N03LAG	Infineon Technologies	Power-Transistor • Ideal for high-frequency dc/dc converters • Qualified according to JEDEC1) for target application • N-channel, logic level • Excellent gate charge x R DS(on) product (FOM) • Superior thermal resistance • 175 °C operating temperature • Pb-free lead
6	H6N03LAG	Infineon Technologies	IPDH6N03LAG • Ideal for high-frequency dc/dc converters • Qualified according to JEDEC1) for target application • N-channel, logic level • Excellent gate charge x R DS(on) product (FOM) • Superior thermal resistance • 175 °C operating temperature • Pb-free lead
7	IPUH6N03LB	Infineon Technologies	OptiMOS2 Power-Transistor J-STD20 and JESD22 Rev. 0.3 page 1 2006-05-15 www.DataSheet.in IPUH6N03LB Parameter Symbol Conditions min. Thermal characteristics Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area