| No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Hitachi Semiconductor |
Silicon Epitaxial Planar Diode for High Speed Switching • Low reverse current.(I R= 0.01 µAmax) • CMPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HSB124S Laser Mark A1 Package Code CMPAK Outline 3 2 1 1 Cathode 2 Anode 3 Cathode Anode |
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Hitachi Semiconductor |
Silicon Schottky Barrier Diode for High Speed Switching • Can be used for protection of signal-bus lines. • The mounting efficiency has been improved by incorporating two low-loss diode element into a CMPAK-4 package. Ordering Information Type No. HSB0104YP Laser Mark E4 Package Code CMPAK-4 Outline 4 |
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Hitachi Semiconductor |
Silicon Epitaxial Planar Diode for High Speed Switching • Low reverse current.(I R= 0.01 µAmax) • CMPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HSB124S Laser Mark A1 Package Code CMPAK Outline 3 2 1 1 Cathode 2 Anode 3 Cathode Anode |
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Hitachi Semiconductor |
Silicon Epitaxial Planar Diode for High Voltage Switching • High reverse voltage. (VR=250V) • CMPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HSB83 Laser Mark F7 Package Code CMPAK Outline 3 2 1 1 NC 2 Anode 3 Cathode (Top View) HSB83 |
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Hitachi Semiconductor |
Silicon Epitaxial Planar Diode for High Voltage Switching • High reverse voltage. (VR=250V) • CMPAK- 4 package which has two devices parallel connection, is suitable for high density surface mounting. Ordering Information Type No. HSB83YP Laser Mark F7 Package Code CMPAK-4 Outline 4 3 1 2 (Top View) 1 |
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Hitachi Semiconductor |
Silicon Schottky Barrier Diode • Low reverse current, Low capacitance. • CMPAK-4 Package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HSB226YP Laser Mark E5 Package Code CMPAK-4 Outline 4 3 1 2 1 2 3 4 Anode Anode Cathode |
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Hitachi Semiconductor |
Silicon Schottky Barrier Diode for Balanced Mixer • High forward current, Low capacitance. • HSB276AS which is interconnected in series configuration is designed for balanced mixer use. • CMPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type |
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Hitachi Semiconductor |
Silicon Schottky Barrier Diode for Balanced Mixer • High forward current, Low capacitance. • HSB276S which is interconnected in series configuration is designed for balanced mixer use. • CMPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type N |
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Hitachi Semiconductor |
Silicon Schottky Barrier Diode for High Speed Switching • Low forward voltage, Low capacitance. • CMPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HSB278S Laser Mark S2 Package Code CMPAK Outline 3 2 1 (Top View) 1 Cathode 2 2 Anode 1 |
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Desde 2024. D4U Semiconductor.
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