| No. | parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
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Gulf Semiconductor |
(RU2AG - RU2MG) FULTRAFAST EFFICIENT GLASS Molded case feature for auto insertion High current capability Low leakage current High surge capability High temperature soldering guaranteed 250° C /10sec/0.375" lead length at 5 lbs tension Glass Passivated chip DO-15\DO-204AC MECHANICAL DATA Te |
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Gulf Semiconductor |
(RU2AGF - RU2JGF) SINTERED GLASS JUNCTION High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Operate at Ta = |
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Gulf Semiconductor |
(RU2AG - RU2MG) FULTRAFAST EFFICIENT GLASS Molded case feature for auto insertion High current capability Low leakage current High surge capability High temperature soldering guaranteed 250° C /10sec/0.375" lead length at 5 lbs tension Glass Passivated chip DO-15\DO-204AC MECHANICAL DATA Te |
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Gulf Semiconductor |
(RU2AG - RU2MG) FULTRAFAST EFFICIENT GLASS Molded case feature for auto insertion High current capability Low leakage current High surge capability High temperature soldering guaranteed 250° C /10sec/0.375" lead length at 5 lbs tension Glass Passivated chip DO-15\DO-204AC MECHANICAL DATA Te |
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|
Gulf Semiconductor |
(RU2AG - RU2MG) FULTRAFAST EFFICIENT GLASS Molded case feature for auto insertion High current capability Low leakage current High surge capability High temperature soldering guaranteed 250° C /10sec/0.375" lead length at 5 lbs tension Glass Passivated chip DO-15\DO-204AC MECHANICAL DATA Te |
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|
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|
Gulf Semiconductor |
(RU2AG - RU2MG) FULTRAFAST EFFICIENT GLASS Molded case feature for auto insertion High current capability Low leakage current High surge capability High temperature soldering guaranteed 250° C /10sec/0.375" lead length at 5 lbs tension Glass Passivated chip DO-15\DO-204AC MECHANICAL DATA Te |
|
|
|
|
Gulf Semiconductor |
(RU2AG - RU2MG) FULTRAFAST EFFICIENT GLASS Molded case feature for auto insertion High current capability Low leakage current High surge capability High temperature soldering guaranteed 250° C /10sec/0.375" lead length at 5 lbs tension Glass Passivated chip DO-15\DO-204AC MECHANICAL DATA Te |
|
|
|
|
Gulf Semiconductor |
(RU2AG - RU2MG) FULTRAFAST EFFICIENT GLASS Molded case feature for auto insertion High current capability Low leakage current High surge capability High temperature soldering guaranteed 250° C /10sec/0.375" lead length at 5 lbs tension Glass Passivated chip DO-15\DO-204AC MECHANICAL DATA Te |
|
|
|
|
Gulf Semiconductor |
(RU2AGF - RU2JGF) SINTERED GLASS JUNCTION High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Operate at Ta = |
|
|
|
|
Gulf Semiconductor |
(RU2AGF - RU2JGF) SINTERED GLASS JUNCTION High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Operate at Ta = |
|
|
|
|
Gulf Semiconductor |
(RU2AGF - RU2JGF) SINTERED GLASS JUNCTION High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Operate at Ta = |
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|
|
|
Gulf Semiconductor |
(RU2AGF - RU2JGF) SINTERED GLASS JUNCTION High temperature metallurgically bonded construction Sintered glass cavity free junction Capability of meeting environmental standard of MIL-S-19500 High temperature soldering guaranteed 350°C /10sec/0.375”lead length at 5 lbs tension Operate at Ta = |
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Desde 2024. D4U Semiconductor.
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