First Silicon HS1 Hoja de datos

No.	parte #	Fabricante	Descripción
1	HS1F	First Silicon	FORWARD CURRENT 1.0AMP ULTRA-FAST RECTIFIER Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at termi
2	HS1K	First Silicon	FORWARD CURRENT 1.0AMP ULTRA-FAST RECTIFIER Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at termi
3	HS1M	First Silicon	FORWARD CURRENT 1.0AMP ULTRA-FAST RECTIFIER Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at termi
4	HS1B	First Silicon	FORWARD CURRENT 1.0AMP ULTRA-FAST RECTIFIER Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at termi
5	HS1D	First Silicon	FORWARD CURRENT 1.0AMP ULTRA-FAST RECTIFIER Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at termi
6	HS1G	First Silicon	FORWARD CURRENT 1.0AMP ULTRA-FAST RECTIFIER Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at termi
7	HS1J	First Silicon	FORWARD CURRENT 1.0AMP ULTRA-FAST RECTIFIER Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at termi
8	HS1A	First Silicon	FORWARD CURRENT 1.0AMP ULTRA-FAST RECTIFIER Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: 250oC/10 seconds at termi