Eris SMB Hoja de datos

No.	parte #	Fabricante	Descripción
1	SMB2EZ6.2D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
2	SMB2EZ16D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
3	SMB2EZ51D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
4	SMB2EZ4.7D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
5	SMB2EZ5.1D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
6	SMB2EZ5.6D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
7	SMB2EZ12D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
8	SMB2EZ17D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
9	SMB2EZ19D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
10	SMB2EZ20D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
11	SMB2EZ27D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
12	SMB2EZ75D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
13	SMB2EZ110D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
14	SMB2EZ200D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
15	SMB2EZ220D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
16	SMB2EZ2.7D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
17	SMB2EZ3.9D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
18	SMB2EZ8.2D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
19	SMB2EZ10D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case
20	SMB2EZ11D5	Eris	Surface Mount Device ‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified Mechanical Data ‧Case