No. | parte # | Fabricante | Descripción | Hoja de Datos |
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ETC |
184 pin Unbuffered DDR DIMM • 184 Dual In-Line Memory Module (DIMM) • Unbuffered DDR DIMM based on 256M bit die B device, organized as either 32Mbx8 or 16Mbx16 • Performance: PC3200 PC2700 PC2100 Speed Sort DIMM CAS Latency fCK tCK Clock Frequency Clock Cycle 5T 3 200 5 400 6K |
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ETC |
184 pin Unbuffered DDR DIMM • 184 Dual In-Line Memory Module (DIMM) • Unbuffered DDR DIMM based on 256M bit die B device, organized as either 32Mbx8 or 16Mbx16 • Performance: PC3200 PC2700 PC2100 Speed Sort DIMM CAS Latency fCK tCK Clock Frequency Clock Cycle 5T 3 200 5 400 6K |
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ETC |
184 pin Unbuffered DDR DIMM • 184 Dual In-Line Memory Module (DIMM) • Unbuffered DDR DIMM based on 256M bit die B device, organized as either 32Mbx8 or 16Mbx16 • Performance: PC3200 PC2700 PC2100 Speed Sort DIMM CAS Latency fCK tCK Clock Frequency Clock Cycle 5T 3 200 5 400 6K |
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ETC |
184 pin Unbuffered DDR DIMM • 184 Dual In-Line Memory Module (DIMM) • Unbuffered DDR DIMM based on 256M bit die B device, organized as either 32Mbx8 or 16Mbx16 • Performance: PC3200 PC2700 PC2100 Speed Sort DIMM CAS Latency fCK tCK Clock Frequency Clock Cycle 5T 3 200 5 400 6K |
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ETC |
2.4 GHz ISM Band Working Frequency ¨ ¨ ¨ ¨ Surface Mounted Devices with a small d imension of 5.2 x 2.0 x 1.1 mm 3 meet future miniaturization trend. Embedded and LTCC (Low Temperature Co -fired Ceramic) technology is able to future integrate with system design as well as beautifyin |
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