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ETC |
Ultra Compact InGaN/SiC SMT LED • High brightness (InGaN/SiC) die material • Available in green (525nm), bluish-green (505nm) • and blue (470nm) colors • Wide 130 degree viewing angle • Reflow and dip soldering compatible • 1000V minimum ESD protection s Applications • Portable ph |
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ETC |
DIP PCB W WW .TW 12V PCB 19.5*7.1*6.9(mm) 1 Form A 100 1A UL .TW 00Y WW 29335 M . 1 00Y DB1A12BW M . O 1 W M . O 29338 DB1A24BW DIP PCB 19.5*7.1*6.9(mm) 1 Form A 1.0A 24V UL W C . O W W C W . Y W W1 Form B .100 T 5V . WW .100Y T DB1B05BW .TW DIP PCB 19.5*7.1 |
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4 Pin DIP/DF 0 M.T O W O W C . O W W W Y W WW .100Y.C M.TW WW .100Y.C M.TW M.T .100 O W O W C W .CO .TW WW .100Y. .TW WW .100Y.C M.TW WW M 00Y Coil Ratings O 1 W M . O W O W WW .100Y.C M.TW W 0Y.C Release Y.C WW TW Operate . 0 0 WW Nominal T . 1 0 M . M Resistanc |
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ETC |
SINGLE PHASE 1.0AMP GLASS PASSIVATED BRIDGE RECTIFIER · Glass passivated die construction · Low forward voltage drop · High current capability · High surge current capability · Plastic material-UL flammability 94V-0 DB-S 0.043（1.1） 0.035（0.9 ） 0.311（7.9） 0.291（7.4） -+ MAX 0.0078（0.2） 0.256（6.5） 0.24 |
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ETC |
SINGLE PHASE 1.0AMP GLASS PASSIVATED BRIDGE RECTIFIER · Glass passivated die construction · Low forward voltage drop · High current capability · High surge current capability · Plastic material-UL flammability 94V-0 DB-S 0.043（1.1） 0.035（0.9 ） 0.311（7.9） 0.291（7.4） -+ MAX 0.0078（0.2） 0.256（6.5） 0.24 |
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ETC |
4 Pin DIP/DF 0 M.T O W O W C . O W W W Y W WW .100Y.C M.TW WW .100Y.C M.TW M.T .100 O W O W C W .CO .TW WW .100Y. .TW WW .100Y.C M.TW WW M 00Y Coil Ratings O 1 W M . O W O W WW .100Y.C M.TW W 0Y.C Release Y.C WW TW Operate . 0 0 WW Nominal T . 1 0 M . M Resistanc |
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ETC |
4 Pin DIP/DF 0 M.T O W O W C . O W W W Y W WW .100Y.C M.TW WW .100Y.C M.TW M.T .100 O W O W C W .CO .TW WW .100Y. .TW WW .100Y.C M.TW WW M 00Y Coil Ratings O 1 W M . O W O W WW .100Y.C M.TW W 0Y.C Release Y.C WW TW Operate . 0 0 WW Nominal T . 1 0 M . M Resistanc |
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ETC |
SINGLE PHASE 1.0AMP GLASS PASSIVATED BRIDGE RECTIFIER · Glass passivated die construction · Low forward voltage drop · High current capability · High surge current capability · Plastic material-UL flammability 94V-0 DB-S 0.043（1.1） 0.035（0.9 ） 0.311（7.9） 0.291（7.4） -+ MAX 0.0078（0.2） 0.256（6.5） 0.24 |
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ETC |
SINGLE PHASE 1.0AMP GLASS PASSIVATED BRIDGE RECTIFIER · Glass passivated die construction · Low forward voltage drop · High current capability · High surge current capability · Plastic material-UL flammability 94V-0 DB-S 0.043（1.1） 0.035（0.9 ） 0.311（7.9） 0.291（7.4） -+ MAX 0.0078（0.2） 0.256（6.5） 0.24 |
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ETC |
SINGLE PHASE 1.0AMP GLASS PASSIVATED BRIDGE RECTIFIER · Glass passivated die construction · Low forward voltage drop · High current capability · High surge current capability · Plastic material-UL flammability 94V-0 DB-S 0.043（1.1） 0.035（0.9 ） 0.311（7.9） 0.291（7.4） -+ MAX 0.0078（0.2） 0.256（6.5） 0.24 |
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ETC |
Thin Type InGaN/SiC SMT LED • High brightness (InGaN/SiC) die material • Available in green (525nm), bluish-green (505nm) • and blue (470nm) colors • Wide 150 degree viewing angle • Reflow and dip soldering compatible • 1000V minimum ESD protection s Applications • Portable ph |
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ETC |
DIP PCB W WW .TW 12V PCB 19.5*7.1*6.9(mm) 1 Form A 100 1A UL .TW 00Y WW 29335 M . 1 00Y DB1A12BW M . O 1 W M . O 29338 DB1A24BW DIP PCB 19.5*7.1*6.9(mm) 1 Form A 1.0A 24V UL W C . O W W C W . Y W W1 Form B .100 T 5V . WW .100Y T DB1B05BW .TW DIP PCB 19.5*7.1 |
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4 Pin DIP/DF 0 M.T O W O W C . O W W W Y W WW .100Y.C M.TW WW .100Y.C M.TW M.T .100 O W O W C W .CO .TW WW .100Y. .TW WW .100Y.C M.TW WW M 00Y Coil Ratings O 1 W M . O W O W WW .100Y.C M.TW W 0Y.C Release Y.C WW TW Operate . 0 0 WW Nominal T . 1 0 M . M Resistanc |
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ETC |
4 Pin DIP/DF 0 M.T O W O W C . O W W W Y W WW .100Y.C M.TW WW .100Y.C M.TW M.T .100 O W O W C W .CO .TW WW .100Y. .TW WW .100Y.C M.TW WW M 00Y Coil Ratings O 1 W M . O W O W WW .100Y.C M.TW W 0Y.C Release Y.C WW TW Operate . 0 0 WW Nominal T . 1 0 M . M Resistanc |
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ETC |
4 Pin DIP/DF 0 M.T O W O W C . O W W W Y W WW .100Y.C M.TW WW .100Y.C M.TW M.T .100 O W O W C W .CO .TW WW .100Y. .TW WW .100Y.C M.TW WW M 00Y Coil Ratings O 1 W M . O W O W WW .100Y.C M.TW W 0Y.C Release Y.C WW TW Operate . 0 0 WW Nominal T . 1 0 M . M Resistanc |
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ETC |
DIP PCB W WW .TW 12V PCB 19.5*7.1*6.9(mm) 1 Form A 100 1A UL .TW 00Y WW 29335 M . 1 00Y DB1A12BW M . O 1 W M . O 29338 DB1A24BW DIP PCB 19.5*7.1*6.9(mm) 1 Form A 1.0A 24V UL W C . O W W C W . Y W W1 Form B .100 T 5V . WW .100Y T DB1B05BW .TW DIP PCB 19.5*7.1 |
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ETC |
DIP PCB W WW .TW 12V PCB 19.5*7.1*6.9(mm) 1 Form A 100 1A UL .TW 00Y WW 29335 M . 1 00Y DB1A12BW M . O 1 W M . O 29338 DB1A24BW DIP PCB 19.5*7.1*6.9(mm) 1 Form A 1.0A 24V UL W C . O W W C W . Y W W1 Form B .100 T 5V . WW .100Y T DB1B05BW .TW DIP PCB 19.5*7.1 |
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ETC |
DIP PCB W WW .TW 12V PCB 19.5*7.1*6.9(mm) 1 Form A 100 1A UL .TW 00Y WW 29335 M . 1 00Y DB1A12BW M . O 1 W M . O 29338 DB1A24BW DIP PCB 19.5*7.1*6.9(mm) 1 Form A 1.0A 24V UL W C . O W W C W . Y W W1 Form B .100 T 5V . WW .100Y T DB1B05BW .TW DIP PCB 19.5*7.1 |
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ETC |
4 Pin DIP/DF 0 M.T O W O W C . O W W W Y W WW .100Y.C M.TW WW .100Y.C M.TW M.T .100 O W O W C W .CO .TW WW .100Y. .TW WW .100Y.C M.TW WW M 00Y Coil Ratings O 1 W M . O W O W WW .100Y.C M.TW W 0Y.C Release Y.C WW TW Operate . 0 0 WW Nominal T . 1 0 M . M Resistanc |
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ETC |
4 Pin DIP/DF 0 M.T O W O W C . O W W W Y W WW .100Y.C M.TW WW .100Y.C M.TW M.T .100 O W O W C W .CO .TW WW .100Y. .TW WW .100Y.C M.TW WW M 00Y Coil Ratings O 1 W M . O W O W WW .100Y.C M.TW W 0Y.C Release Y.C WW TW Operate . 0 0 WW Nominal T . 1 0 M . M Resistanc |
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Desde 2024. D4U Semiconductor.
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