Dynex Semiconductor MP0 Hoja de datos

No.	parte #	Fabricante	Descripción
1	MP03HBP360-12	Dynex Semiconductor	Thyristor/Diode Module s Dual Device Module s Electrically Isolated Package www.DataShsePetr4eUs.scuorme Contact Construction s International Standard Footprint s Alumina (Non Toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Con
2	MP04HB910	Dynex Semiconductor	Dual Rectifier Diode s Dual Device Module s Electrically Isolated Package s Pressure Contact Construction s International Standard Footprint s Alumina (Non-toxic) Isolation Medium APPLICATIONS s Power Supplies s Large IGBT Circuit 'Front Ends' s Rectifiers s Battery Cha
3	MP04HBT490-26	Dynex Semiconductor	Thyristor/Diode Module s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM IT(AV) ITSM(per arm) Visol 2800V 49
4	MP03HBT360-12	Dynex Semiconductor	Thyristor/Diode Module s Dual Device Module s Electrically Isolated Package www.DataShsePetr4eUs.scuorme Contact Construction s International Standard Footprint s Alumina (Non Toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Con
5	MP03HBT360-10	Dynex Semiconductor	Thyristor/Diode Module s Dual Device Module s Electrically Isolated Package www.DataShsePetr4eUs.scuorme Contact Construction s International Standard Footprint s Alumina (Non Toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Con
6	MP03HBT360-08	Dynex Semiconductor	Thyristor/Diode Module s Dual Device Module s Electrically Isolated Package www.DataShsePetr4eUs.scuorme Contact Construction s International Standard Footprint s Alumina (Non Toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Con
7	MP03HBN360-12	Dynex Semiconductor	Thyristor/Diode Module s Dual Device Module s Electrically Isolated Package www.DataShsePetr4eUs.scuorme Contact Construction s International Standard Footprint s Alumina (Non Toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Con
8	MP03HBN360-10	Dynex Semiconductor	Thyristor/Diode Module s Dual Device Module s Electrically Isolated Package www.DataShsePetr4eUs.scuorme Contact Construction s International Standard Footprint s Alumina (Non Toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Con
9	MP03HBN360-08	Dynex Semiconductor	Thyristor/Diode Module s Dual Device Module s Electrically Isolated Package www.DataShsePetr4eUs.scuorme Contact Construction s International Standard Footprint s Alumina (Non Toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Con
10	MP03HBP360-10	Dynex Semiconductor	Thyristor/Diode Module s Dual Device Module s Electrically Isolated Package www.DataShsePetr4eUs.scuorme Contact Construction s International Standard Footprint s Alumina (Non Toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Con
11	MP03HBP360-08	Dynex Semiconductor	Thyristor/Diode Module s Dual Device Module s Electrically Isolated Package www.DataShsePetr4eUs.scuorme Contact Construction s International Standard Footprint s Alumina (Non Toxic) Isolation Medium APPLICATIONS s Motor Control s Controlled Rectifier Bridges s Heater Con
12	MP04DD810	Dynex Semiconductor	Dual Rectifier Diode s Dual Device Module s Electrically Isolated Package s Pressure Contact Construction s International Standard Footprint s Alumina (Non-toxic) Isolation Medium MP04DD810 Dual Rectifier Diode Water Cooled Module Preliminary Information DS5286-2.1 June
13	MP04TT1400	Dynex Semiconductor	Dual Thyristor Water Cooled Welding Module Preliminary Information s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM ILINE(cont.) ILINE(20cy./50%) ITSM(p
14	MP04TT1550	Dynex Semiconductor	Dual Thyristor Water Cooled Welding Module Preliminary Information s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM ILINE(cont.) ILINE(20cy./50%) ITSM(p
15	MP04TT500	Dynex Semiconductor	Dual Thyristor Water Cooled Module Advance Information s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM IT(AV)(per arm) ITSM(per arm) IT(RMS
16	MP04TT600	Dynex Semiconductor	Dual Thyristor Water Cooled Module Preliminary Information s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM IT(AV) ITSM(per arm) IT(RMS) Visol
17	MP04HBT490-28	Dynex Semiconductor	Thyristor/Diode Module s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM IT(AV) ITSM(per arm) Visol 2800V 49
18	MP04HBT490-24	Dynex Semiconductor	Thyristor/Diode Module s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM IT(AV) ITSM(per arm) Visol 2800V 49
19	MP04HBP490-28	Dynex Semiconductor	Thyristor/Diode Module s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM IT(AV) ITSM(per arm) Visol 2800V 49
20	MP04HBP490-26	Dynex Semiconductor	Thyristor/Diode Module s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral Water Cooled Heatsink KEY PARAMETERS VDRM IT(AV) ITSM(per arm) Visol 2800V 49