DIOTEC UFR Hoja de datos

No.	parte #	Fabricante	Descripción
1	UFR101	DIOTEC Electronics Corporation	(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE
2	UFR100	DIOTEC Electronics Corporation	(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE
3	UFR3002C	DIOTEC	30AMP ULTRAFAST RECOVERY DIODES Glass Passivated for high reliability/temperature performance Low switching noise Low forward voltage drop Low thermal resistance High switching capability High surge capability MECHANICAL SPECIFICATION ACTUAL SIZE OF TO-247AB (TO-3PAB) PACKAGE A
4	UFR103	DIOTEC Electronics Corporation	(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE
5	UFR105	DIOTEC Electronics Corporation	(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE
6	UFR106	DIOTEC Electronics Corporation	(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE
7	UFR108	DIOTEC Electronics Corporation	(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE
8	UFR110	DIOTEC Electronics Corporation	(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE
9	UFR3001C	DIOTEC	30AMP ULTRAFAST RECOVERY DIODES Glass Passivated for high reliability/temperature performance Low switching noise Low forward voltage drop Low thermal resistance High switching capability High surge capability MECHANICAL SPECIFICATION ACTUAL SIZE OF TO-247AB (TO-3PAB) PACKAGE A
10	UFR3003C	DIOTEC	30AMP ULTRAFAST RECOVERY DIODES Glass Passivated for high reliability/temperature performance Low switching noise Low forward voltage drop Low thermal resistance High switching capability High surge capability MECHANICAL SPECIFICATION ACTUAL SIZE OF TO-247AB (TO-3PAB) PACKAGE A
11	UFR3004C	DIOTEC	30AMP ULTRAFAST RECOVERY DIODES Glass Passivated for high reliability/temperature performance Low switching noise Low forward voltage drop Low thermal resistance High switching capability High surge capability MECHANICAL SPECIFICATION ACTUAL SIZE OF TO-247AB (TO-3PAB) PACKAGE A
12	UFR3005C	DIOTEC	30AMP ULTRAFAST RECOVERY DIODES Glass Passivated for high reliability/temperature performance Low switching noise Low forward voltage drop Low thermal resistance High switching capability High surge capability MECHANICAL SPECIFICATION ACTUAL SIZE OF TO-247AB (TO-3PAB) PACKAGE A
13	UFR102	DIOTEC Electronics Corporation	(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE
14	UFR104	DIOTEC Electronics Corporation	(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE