DIOTEC MR2 Hoja de datos

No.	parte #	Fabricante	Descripción
1	MR2406FR	DIOTEC	25 AMP SOFT RECOVERY FAST SWITCHING TAB MOUNTED DIODES VOID FREE Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) True Soft Recovery Characteristic With No Ringing, Spikes, or Overshoot MECHANICAL SPECIFICATION CA D5 D3 fP
2	MR2400R	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x 0.160" Square f Large Die For High Power Heavy Duty Performance H
3	MR2404FR	DIOTEC	25 AMP SOFT RECOVERY FAST SWITCHING TAB MOUNTED DIODES VOID FREE Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) True Soft Recovery Characteristic With No Ringing, Spikes, or Overshoot MECHANICAL SPECIFICATION CA D5 D3 fP
4	MR2400	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Suggested Alternative For The MR2400, MR2401, MR2402, MR2404, MR2406 Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x
5	MR2402FR	DIOTEC	25 AMP SOFT RECOVERY FAST SWITCHING TAB MOUNTED DIODES VOID FREE Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) True Soft Recovery Characteristic With No Ringing, Spikes, or Overshoot MECHANICAL SPECIFICATION CA D5 D3 fP
6	MR2401	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Suggested Alternative For The MR2400, MR2401, MR2402, MR2404, MR2406 Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x
7	MR2406	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Suggested Alternative For The MR2400, MR2401, MR2402, MR2404, MR2406 Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x
8	MR2402F	DIOTEC	25 AMP SOFT RECOVERY FAST SWITCHING TAB MOUNTED DIODES MECHANICAL SPECIFICATION Suggested Alternative For MR2400F, MR2401F, MR2404F, and MR2406F True Soft Recovery Characteristic With No Ringing, Spikes, or Overshoot C D5 D3 A fP HIGH Frequency: 250 kHz FAST Recovery: 100nS - 150nS D1 Unmatched Pe
9	MR2501	DIOTEC	25AMP BUTTON DIODES MECHANICAL SPECIFICATION Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) Large Die For High Power Heavy Duty Performance High Heat Handling Capability With Ver
10	MR2502	DIOTEC	25AMP BUTTON DIODES MECHANICAL SPECIFICATION Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) Large Die For High Power Heavy Duty Performance High Heat Handling Capability With Ver
11	MR2510	DIOTEC	25AMP BUTTON DIODES MECHANICAL SPECIFICATION Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) Large Die For High Power Heavy Duty Performance High Heat Handling Capability With Ver
12	MR2401FR	DIOTEC	25 AMP SOFT RECOVERY FAST SWITCHING TAB MOUNTED DIODES VOID FREE Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) True Soft Recovery Characteristic With No Ringing, Spikes, or Overshoot MECHANICAL SPECIFICATION CA D5 D3 fP
13	MR2400FR	DIOTEC	25 AMP SOFT RECOVERY FAST SWITCHING TAB MOUNTED DIODES VOID FREE Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) True Soft Recovery Characteristic With No Ringing, Spikes, or Overshoot MECHANICAL SPECIFICATION CA D5 D3 fP
14	MR2401R	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x 0.160" Square f Large Die For High Power Heavy Duty Performance H
15	MR2402R	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x 0.160" Square f Large Die For High Power Heavy Duty Performance H
16	MR2404R	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x 0.160" Square f Large Die For High Power Heavy Duty Performance H
17	MR2406R	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x 0.160" Square f Large Die For High Power Heavy Duty Performance H
18	MR2402	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Suggested Alternative For The MR2400, MR2401, MR2402, MR2404, MR2406 Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x
19	MR2404	DIOTEC	25 AMP TAB MOUNTED BUTTON DIODES Suggested Alternative For The MR2400, MR2401, MR2402, MR2404, MR2406 Void Free Vacuum Die Soldering For Maximum Mechanical Strength And Heat Dissipation (Solder Voids: Typical < 2%, Max. < 10% of Die Area) MECHANICAL SPECIFICATION Die Size: 0.160" x
20	MR2400F	DIOTEC	25 AMP SOFT RECOVERY FAST SWITCHING TAB MOUNTED DIODES MECHANICAL SPECIFICATION Suggested Alternative For MR2400F, MR2401F, MR2404F, and MR2406F True Soft Recovery Characteristic With No Ringing, Spikes, or Overshoot C D5 D3 A fP HIGH Frequency: 250 kHz FAST Recovery: 100nS - 150nS D1 Unmatched Pe