No. | parte # | Fabricante | Descripción | Hoja de Datos |
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DIOTEC Electronics |
(SBU4x) 4 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOA |
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Diotec Electronics Corporation |
(SBU6x) General Purpose Diodes MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHAN |
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Diotec Electronics Corporation |
(SBU6x) General Purpose Diodes MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHAN |
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Diotec Electronics Corporation |
(SBU6x) General Purpose Diodes MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHAN |
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Diotec Electronics Corporation |
(SBU6x) General Purpose Diodes MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHAN |
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Diotec Electronics Corporation |
(SBU6x) General Purpose Diodes MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHAN |
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DIOTEC Electronics |
(SBU4x) 4 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOA |
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DIOTEC Electronics |
(SBU4x) 4 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOA |
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DIOTEC Electronics |
(SBU4x) 4 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOA |
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DIOTEC Electronics |
(SBU4x) 4 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOA |
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DIOTEC Electronics |
(SBU4x) 4 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOA |
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Diotec Electronics Corporation |
(SBU6x) General Purpose Diodes MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHAN |
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Diotec Electronics Corporation |
(SBU6x) General Purpose Diodes MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHAN |
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DIOTEC Electronics |
(SBU4x) 4 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOA |
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