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DIOTEC Electronics Corporation |
(GP100 - GP110) 1 AMP HIGH RELIABILITY SILICON DIODES MECHANICAL SPECIFICATION R PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) |
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DIOTEC Electronics Corporation |
(GP600 - GP610) 6 AMP GENERAL PURPOSE SILICON DIODES MECHANICAL SPECIFICATION ACTUAL SIZE OF GP600 PACKAGE ¾ ¿ ÀÂÁ¿ ÃÄ ¾ ¿ ÀÅ ÆÇ)ÈÇ É)Æ ¾ ¿ ÀËÊ6¿bÌ ÀqÇAÌ6ÍgÎ ¿bÅ Ä Ç$É)ÆÏÍbÌ6¿bÐ ÑÓÒ ÉbÔÁ ÕAÌeÌ Æ)ÖÄ"Á©ÇAÐTÇ$Á)Ò Ä × www.DataSheet4U.com Ç©ÃA Å ×g ÃØ"¿b Å Î$Ò ÆA Ö©ÄÁ)Ã Å Æ$Ç)Ö$Æ$ÍgÀgÒ ÄeÔÙÊeÌ Æ ¿bÖ |
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DIOTEC Electronics Corporation |
(GP600 - GP610) 6 AMP GENERAL PURPOSE SILICON DIODES MECHANICAL SPECIFICATION ACTUAL SIZE OF GP600 PACKAGE ¾ ¿ ÀÂÁ¿ ÃÄ ¾ ¿ ÀÅ ÆÇ)ÈÇ É)Æ ¾ ¿ ÀËÊ6¿bÌ ÀqÇAÌ6ÍgÎ ¿bÅ Ä Ç$É)ÆÏÍbÌ6¿bÐ ÑÓÒ ÉbÔÁ ÕAÌeÌ Æ)ÖÄ"Á©ÇAÐTÇ$Á)Ò Ä × www.DataSheet4U.com Ç©ÃA Å ×g ÃØ"¿b Å Î$Ò ÆA Ö©ÄÁ)Ã Å Æ$Ç)Ö$Æ$ÍgÀgÒ ÄeÔÙÊeÌ Æ ¿bÖ |
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DIOTEC Electronics Corporation |
(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE |
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DIOTEC Electronics Corporation |
(GP100 - GP110) 1 AMP HIGH RELIABILITY SILICON DIODES MECHANICAL SPECIFICATION R PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) |
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DIOTEC Electronics Corporation |
(DB800 - DB810) 8 AMP SILICON BRIDGE RECTIFIERS VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE SURGE OVERLOAD RATING TO 400 AMPS PEAK |
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DIOTEC Electronics Corporation |
(UFR100 - UFR110) 1 AMP ULTRAFAST RECOVERY DIODES PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) LOW SWITCHING NOISE LOW THE |
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Diotec Electronics Corporation |
(SK502 - SK510) 5 AMP SCHOTTKY BARRIER RECTIFIERS MECHANICAL SPECIFICATION ACTUAL SIZE OF DO-27 PACKAGE SERIES SK502 - SK510 DO-27 Metal semiconductor junction with guard ring Epitaxial Construction LL Low forward voltage drop High current capacity BL For use in low voltage, high frequency inver |
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DIOTEC Electronics Corporation |
(ADB2504 - ADB2508) 25 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION SERIES: DB2500 - DB2510 and ADB2504 - ADB2508 VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPE |
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DIOTEC Electronics Corporation |
(ADB2504 - ADB2508) 25 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION SERIES: DB2500 - DB2510 and ADB2504 - ADB2508 VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPE |
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DIOTEC Electronics Corporation |
(ADB2504P - ADB2508P) 25 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION SERIES: DB2500P - DB2510P and ADB2504P - ADB2508P VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR |
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DIOTEC Electronics Corporation |
(ADB2504P - ADB2508P) 25 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION SERIES: DB2500P - DB2510P and ADB2504P - ADB2508P VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR |
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DIOTEC Electronics Corporation |
(ADB2504P - ADB2508P) 25 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION SERIES: DB2500P - DB2510P and ADB2504P - ADB2508P VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR |
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DIOTEC Electronics Corporation |
(GP100 - GP110) 1 AMP HIGH RELIABILITY SILICON DIODES MECHANICAL SPECIFICATION R PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) |
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DIOTEC Electronics Corporation |
(GP100 - GP110) 1 AMP HIGH RELIABILITY SILICON DIODES MECHANICAL SPECIFICATION R PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) |
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DIOTEC Electronics Corporation |
(ADB1004 - ADB1008) 10 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION ACTUAL SIZE DT DB1004 VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PER |
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DIOTEC Electronics Corporation |
(ADB1004 - ADB1008) 10 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION ACTUAL SIZE DT DB1004 VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PER |
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DIOTEC Electronics Corporation |
(ADB1004 - ADB1008) 10 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION ACTUAL SIZE DT DB1004 VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PER |
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DIOTEC Electronics Corporation |
(ADB1504 - ADB1508) 15 AMP SILICON BRIDGE RECTIFIERS MECHANICAL SPECIFICATION SERIES: DB1500 - DB1510 and ADB1504 - ADB1508 BH VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR S |
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Diotec Electronics Corporation |
(SBU6x) General Purpose Diodes MECHANICAL SPECIFICATION SBU PACKAGE SHOWN ACTUAL SIZE C C1 C2 D D3 _ D2 + D D1 A VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHAN |
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Desde 2024. D4U Semiconductor.
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