No. | parte # | Fabricante | Descripción | Hoja de Datos |
---|---|---|---|---|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Terminals/Plastic COMCHIP www.comchiptech.com Lead/Pla |
|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Terminals/Plastic COMCHIP www.comchiptech.com Lead/Pla |
|
|
|
Comchip Technology |
Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Current Capability High Reliability High Surge Current Capability Ideal for Printed Circuit Boards Mechanical Data Case: Molded Plastic Terminals: Plated Leads Solderable per MIL-STD-202, Method 208 |
|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Mechanical Data Case:Epoxy Case with Heat Sink Interna |
|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Terminals/Plastic COMCHIP www.comchiptech.com Lead/Pla |
|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Terminals/Plastic COMCHIP www.comchiptech.com Lead/Pla |
|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Terminals/Plastic COMCHIP www.comchiptech.com Lead/Pla |
|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Terminals/Plastic COMCHIP www.comchiptech.com Lead/Pla |
|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Terminals/Plastic COMCHIP www.comchiptech.com Lead/Pla |
|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Terminals/Plastic COMCHIP www.comchiptech.com Lead/Pla |
|
|
|
Comchip Technology |
High Current Bridge Rectifier Surge overload 200 - 400 Amp peak Low forward voltage dro Mounting position: Any Electrically isolated base - 1800 Volts Solderable 0.25” FASTON terminals Materials used carries U/L recognition Terminals/Plastic COMCHIP www.comchiptech.com Lead/Pla |
|
|
|
Comchip Technology |
Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Current Capability High Reliability High Surge Current Capability Ideal for Printed Circuit Boards Mechanical Data Case: Molded Plastic Terminals: Plated Leads Solderable per MIL-STD-202, Method 208 |
|
|
|
Comchip Technology |
Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Current Capability High Reliability High Surge Current Capability Ideal for Printed Circuit Boards Mechanical Data Case: Molded Plastic Terminals: Plated Leads Solderable per MIL-STD-202, Method 208 |
|
|
|
Comchip Technology |
(KBP200-G - KBP210-G) Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Reliability High Current Capability High Surge Current Capability Ideal for Printed Circuit Boards H J D E I G B + ~ ~ A C KBP Min. Max Dim 14.22 15.24 A B 11.68 10.67 C 11.68 12.70 D 4.57 5.08 3.60 4. |
|
|
|
Comchip Technology |
(KBP200-G - KBP210-G) Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Reliability High Current Capability High Surge Current Capability Ideal for Printed Circuit Boards H J D E I G B + ~ ~ A C KBP Min. Max Dim 14.22 15.24 A B 11.68 10.67 C 11.68 12.70 D 4.57 5.08 3.60 4. |
|
|
|
Comchip Technology |
(KBP200-G - KBP210-G) Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Reliability High Current Capability High Surge Current Capability Ideal for Printed Circuit Boards H J D E I G B + ~ ~ A C KBP Min. Max Dim 14.22 15.24 A B 11.68 10.67 C 11.68 12.70 D 4.57 5.08 3.60 4. |
|
|
|
Comchip Technology |
(KBP200-G - KBP210-G) Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Reliability High Current Capability High Surge Current Capability Ideal for Printed Circuit Boards H J D E I G B + ~ ~ A C KBP Min. Max Dim 14.22 15.24 A B 11.68 10.67 C 11.68 12.70 D 4.57 5.08 3.60 4. |
|
|
|
Comchip Technology |
(KBP200-G - KBP210-G) Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Reliability High Current Capability High Surge Current Capability Ideal for Printed Circuit Boards H J D E I G B + ~ ~ A C KBP Min. Max Dim 14.22 15.24 A B 11.68 10.67 C 11.68 12.70 D 4.57 5.08 3.60 4. |
|
|
|
Comchip Technology |
(KBP200-G - KBP210-G) Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Reliability High Current Capability High Surge Current Capability Ideal for Printed Circuit Boards H J D E I G B + ~ ~ A C KBP Min. Max Dim 14.22 15.24 A B 11.68 10.67 C 11.68 12.70 D 4.57 5.08 3.60 4. |
|
|
|
Comchip Technology |
(KBP200-G - KBP210-G) Silicon Bridge Rectifiers Diffused Junction Low Forward Voltage Drop High Reliability High Current Capability High Surge Current Capability Ideal for Printed Circuit Boards H J D E I G B + ~ ~ A C KBP Min. Max Dim 14.22 15.24 A B 11.68 10.67 C 11.68 12.70 D 4.57 5.08 3.60 4. |
|