No. | parte # | Fabricante | Descripción | Hoja de Datos |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current A B Electrical Characteristics Chip size(A): 1.524* 1.524 mm2 Bond Pad size(B) : 1.422 *1.422 mm2 Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag Met |
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Champion Microelectronic |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.016 * 1.016 mm 2 Bond Pad size(B) : 0.889 * 0.889 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.270 * 1.270 mm 2 Bond Pad size(B) : 1.143 *1.143 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode |
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Champion Microelectronic |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.889 * 0.889 mm 2 Bond Pad size(B) : 0.762 * 0.762 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.524* 1.524 mm 2 Bond Pad size(B) : 1.422 *1.422 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode T |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current A B Electrical Characteristics Chip size(A): 0.814 * 0.814 mm2 Bond Pad size(B) : 0.686 * 0.686 mm2 Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag M |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current A B Electrical Characteristics Chip size(A): 0.889 * 0.889 mm2 Bond Pad size(B) : 0.762 * 0.762 mm2 Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag M |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current A B Electrical Characteristics Chip size(A): 0.889 * 0.889 mm2 Bond Pad size(B) : 0.762 * 0.762 mm2 Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag M |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current A B Electrical Characteristics Chip size(A): 1.016 * 1.016 mm2 Bond Pad size(B) : 0.889 * 0.889 mm2 Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag M |
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|
Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current A B Electrical Characteristics Chip size(A): 1.016 * 1.016 mm2 Bond Pad size(B) : 0.889 * 0.889 mm2 Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag M |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current A B Electrical Characteristics Chip size(A): 1.524* 1.524 mm2 Bond Pad size(B) : 1.422 *1.422 mm2 Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag Met |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current A B Electrical Characteristics Chip size(A): 1.830* 1.830 mm2 Bond Pad size(B) : 1.702 *1.702 mm2 Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag Met |
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Champion Microelectronic |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.814 * 0.814 mm 2 Bond Pad size(B)) : 0.686 * 0.686 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathod |
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Champion Microelectronic |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.814 * 0.814 mm 2 Bond Pad size(B) : 0.686 * 0.686 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode |
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Champion Microelectronic |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 0.889 * 0.889 mm 2 Bond Pad size(B) : 0.762 * 0.762 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode |
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Champion Microelectronic |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.016 * 1.016 mm 2 Bond Pad size(B) : 0.889 * 0.889 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.016 * 1.016 mm 2 Bond Pad size(B) : 0.889 * 0.889 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.524* 1.524 mm 2 Bond Pad size(B) : 1.422 *1.422 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode T |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.830* 1.830 mm 2 Bond Pad size(B) : 1.702 *1.702 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode T |
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Champion |
SCHOTTKY BARRIER DIODE : * Extremely low forward volts * Guard ring protection * Low reverse leakage current Chip size(A): 1.830* 1.830 mm 2 Bond Pad size(B) : 1.702 *1.702 mm 2 A Thickness : 300µm ± 20µm Metalization : Anode Ti/Ni/Ag B Metalization : Cathode T |
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