No. | parte # | Fabricante | Descripción | Hoja de Datos |
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CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
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CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
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|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODES • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Plastic package has Underwriters Laboratory Flammability Classification 94V-O • Pb free |
|
|
|
CUMSUMI |
SURFACE MOUNT SILICON ZENER DIODE • For surface mounted applications in order to optimize board space. • Low profile package • Built-in strain relief • Glass passivated junction • Low inductance • Typical IR less than 1.0µA above 12V • Plastic package has Underwriters Laboratory Flam |
|