No. | parte # | Fabricante | Descripción | Hoja de Datos |
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CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
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CITC |
1A Surface Mount Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(SK12B~SK16B). standard >10ΚV(SK110B~SK120B). • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capabilit |
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CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
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|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
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|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
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|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(SK12A~SK16A). standard >10ΚV(SK110A~SK120A). • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capabilit |
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CITC |
1A Surface Mount Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(SK12A~SK16A). standard >10ΚV(SK110A~SK120A). • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capabilit |
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|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(SK12B~SK16B). standard >10ΚV(SK110B~SK120B). • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capabilit |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(SK12B~SK16B). standard >10ΚV(SK110B~SK120B). • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capabilit |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(SK12B~SK16B). standard >10ΚV(SK110B~SK120B). • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capabilit |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(SK12B~SK16B). standard >10ΚV(SK110B~SK120B). • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capabilit |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(SK12B~SK16B). standard >10ΚV(SK110B~SK120B). • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capabilit |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
|
|
|
CITC |
1A Surface Mount Schottky Barrier Rectifiers • Low profile surface mounted application in order to optimize board space. • Low power loss, high efficiency. • High current capability, low forward voltage drop. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. |
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