No. | parte # | Fabricante | Descripción | Hoja de Datos |
---|---|---|---|---|
|
|
CITC |
30A High Power Schottky Barrier Rectifiers ■ Outline • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction |
|
|
|
CITC |
20A Surface Mount High Power Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(ΜΒRΒ2040CT~ΜΒRΒ2065CT). standard >10ΚV(ΜΒRΒ20100CT~ΜΒRΒ20200CT). • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • |
|
|
|
CITC |
20A High Power Schottky Barrier Rectifiers ■ Outline • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction |
|
|
|
CITC |
10A High Power Schottky Barrier Rectifiers • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Suffix " |
|
|
|
CITC |
20A High Power Schottky Barrier Rectifiers ■ Outline • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction |
|
|
|
CITC |
20A High Power Schottky Barrier Rectifiers ■ Outline • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(ΜΒR2040~ΜΒR2065). standard >10ΚV(ΜΒR20100~ΜΒR20200). • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • |
|
|
|
CITC |
30A Surface Mount High Power Schottky Barrier Rectifiers • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Suffix " |
|
|
|
CITC |
20A High Power Schottky Barrier Rectifiers ■ Outline • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction |
|
|
|
CITC |
20A Surface Mount High Power Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(ΜΒRΒ2040CT~ΜΒRΒ2065CT). standard >10ΚV(ΜΒRΒ20100CT~ΜΒRΒ20200CT). • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • |
|
|
|
CITC |
Trench Schottky Rectifier • Low forward voltage drop. • Excellent high temperature stability. • Fast switching capability. • Lead-free parts meet environmental standards of MIL-STD-19500 /228 ■ Mechanical Data • Epoxy : UL94-V0 rated flame retardant. • Case : JEDEC ITO-220AB |
|
|
|
CITC |
Trench Schottky Rectifier • Low forward voltage drop. • Excellent high temperature stability. • Fast switching capability. • Lead-free parts meet environmental standards of MIL-STD-19500 /228 ■ Mechanical Data • Epoxy : UL94-V0 rated flame retardant. • Case : JEDEC ITO-220AB |
|
|
|
CITC |
Trench Schottky Rectifier • Low forward voltage drop. • Excellent high temperature stability. • Fast switching capability. • Lead-free parts meet environmental standards of MIL-STD-19500 /228 ■ Mechanical data • Epoxy : UL94-V0 rated flame retardant. • Case : JEDEC TO-220AB |
|
|
|
CITC |
Trench Schottky Rectifier • Low forward voltage drop. • Excellent high temperature stability. • Fast switching capability. • Lead-free parts meet environmental standards of MIL-STD-19500 /228 ■ Mechanical data • Epoxy : UL94-V0 rated flame retardant. • Case : JEDEC TO-220AB |
|
|
|
CITC |
Trench Schottky Rectifier • Low forward voltage drop. • Excellent high temperature stability. • Fast switching capability. • Lead-free parts meet environmental standards of MIL-STD-19500 /228 ■ Mechanical data • Epoxy : UL94-V0 rated flame retardant. • Case : JEDEC ITO-220AB |
|
|
|
CITC |
Trench Schottky Rectifier • Low forward voltage drop. • Excellent high temperature stability. • Fast switching capability. • Lead-free parts meet environmental standards of MIL-STD-19500 /228 ■ Mechanical Data • Epoxy : UL94-V0 rated flame retardant. • Case : JEDEC TO-220AB m |
|
|
|
CITC |
20A High Power Schottky Barrier Rectifiers ■ Outline • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction |
|
|
|
CITC |
10A High Power Schottky Barrier Rectifiers ■ Outline • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(ΜΒR1040~ΜΒR1065). standard >10ΚV(ΜΒR10100~ΜΒR10200). • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • |
|
|
|
CITC |
10A High Power Schottky Barrier Rectifiers • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Suffix " |
|
|
|
CITC |
30A High Power Schottky Barrier Rectifiers ■ Outline • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction |
|
|
|
CITC |
20A Surface Mount High Power Schottky Barrier Rectifiers • Electrostatic discharge (ESD) test under IEC6100-4-2 standard >16ΚV(ΜΒRΒ2040CT~ΜΒRΒ2065CT). standard >10ΚV(ΜΒRΒ20100CT~ΜΒRΒ20200CT). • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • |
|