Bruckewell Technology SS1 Hoja de datos

No.	parte #	Fabricante	Descripción
1	SS15P50	Bruckewell Technology	High Current Density Surface Mount Schottky Rectifi Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to Ro
2	SS10PU50A	Bruckewell Technology	High Current Density Surface Mount Schottky Rectifi Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to Ro
3	SS10PU50B	Bruckewell Technology	High Current Density Surface Mount Schottky Rectifi Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to Ro
4	SS10PU200	Bruckewell Technology	High Current Density Surface Mount Ultra Low VF Schottky Rectifier Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to Ro
5	SS10PU100S	Bruckewell Technology	High Current Density Surface Mount Ultra Low VF Schottky Rectifier Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to Ro
6	SS10PU100	Bruckewell Technology	High Current Density Surface Mount Ultra Low VF Schottky Rectifier Very low profile - typical height of 1.1 mm Ideal for automated placement Low forward voltage drop, low power losses High efficiency Low thermal resistance Meets MSL level 1, per J-STD-020 Solder dip 260 °C max. 10 s, per JESD 22-A111 Compliant to Ro