| No. | parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
|
|
|
Bergquist |
Gel-Like Modulus Gap Filling Material and Benefits • Thermal conductivity: 1.0 W/m-K • Highly conformable, low hardness • “Gel-like” modulus • Fiberglass reinforced for puncture, shear and tear resistance Gap Pad HC 1000 is an extremely conformable, low-modulus polymer that acts as a th |
|
Desde 2024. D4U Semiconductor.
|