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TSM4405P P-Channel MOSFET

TSM4405P

TSM4405P
TSM4405P TSM4405P
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Part Number TSM4405P
Manufacturer Taiwan Semiconductor Company
Description Bump Side View TSM4405P is new low cost, state of the art MicroSURFTM lateral MOSFET process technology in chip scale bondwireless packaging minimizes PCB space and Rds(on) plus provides an ultra low Qg x Rds(on) figure of merit. Features Low profile package: less than 0.8mm height when mounted on PCB Occupies only 1.21mm of PCB area 2 Less than 30% of t.
Features Low profile package: less than 0.8mm height when mounted on PCB Occupies only 1.21mm of PCB area 2 Less than 30% of the area of a SC-70 Excellent thermal and electrical capabilities Lead free solder bumps available Block Diagram Ordering Information Part No. TSM4405P Packing Tape & Reel Q’ty 3kpcs / 7” Absolute Maximum Rating (Ta = 25 oC unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Maximum Power Dissipation (Steady State) Operating Junction Temperature Operating Junction and Storage Temperature Range Symbol VDS VG.
Datasheet Datasheet TSM4405P Data Sheet
PDF 206.28KB
Distributor Stock Price Buy

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