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| Part Number | RFANT5220110A0T |
| Distributor | Stock | Price | Buy |
|---|
| Part Number | RFANT5220110A0T |
| Manufacturer | Walsin |
| Title | Broad Band Ceramic Antenna |
| Description | Walsin Technology Corporation LTCC Multi Layer Chip Antenna – Broad Band Type For ISM Band 2.4GHz Application Patent Pending Surface Mounted Devices with a small dimension 3 of 5.2 x 2.0 x 1.1 mm meet future miniaturization trend. Embedded and LTCC (Low Temperature Co-fired Ceramic) technology i. |
| Features | alsin Technology Corporation. Tel : 886-3-475-8711 Fax : 886-3-475-5197 E mail : [email protected] Web Site : http://www.passivecomponent.com Specification subject to change without prior notice. Introduction of RFANT5220110A0T June. 2005 http://www.Datasheet4U.com . |
| Part Number | RFANT5220110A0T |
| Manufacturer | ETC |
| Title | 2.4 GHz ISM Band Working Frequency |
| Description | Our new ceramic embedded sem i-antenna specified for 2.4 GHz ISM Band applic ation, as shown in below “CONSTRUCTION”. Both of Wireless LAN IEEE 802.11b and Bluetooth TM typically located on this unlicensed frequency band which range covers from 2.4GHz to 2.4835GHz. To fulfil the friendly usage for a. |
| Features | ¨ ¨ ¨ ¨ Surface Mounted Devices with a small d imension of 5.2 x 2.0 x 1.1 mm 3 meet future miniaturization trend. Embedded and LTCC (Low Temperature Co -fired Ceramic) technology is able to future integrate with system design as well as beautifying the housing of final product. High Stability in Temper ature / Humidity Change Free Impedance Matching APPLICATIONS ¨ ¨ ¨ ¨ Bluetooth Wireless LAN. |
| Part Number | RFANT5220110A0T |
| Manufacturer | PSA |
| Title | MULTILAYER CERAMIC ANTENNA |
| Description | Walsin Technology Corporation develops a new ceramic embedded antenna specified for 2.4 GHz ISM Band application, as TM shown in below “CONSTRUCTION”. Both of Wireless LAN IEEE 802.11b and Bluetooth typically located on this unlicensed frequency band which range covers from 2.4GHz to 2.4835GHz. To f. |
| Features | 3 1. Surface Mounted Devices with a small dimension of 5.2 x 2.0 x 1.1 mm meet future miniaturization trend. 2. Embedded and LTCC (Low Temperature Co-fired Ceramic) technology is able to future integrate with system design as well as beautifying the housing of final product. 3. High Stability in Temperature / Humidity Change APPLICATIONS 1. Bluetooth 2. Wireless LAN 3. HormRF 4. ISM band 2.4GHz wi. |
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