Busque con el número de pieza junto con el fabricante o la descripción
| Part Number | LQFP44 |
| Distributor | Stock | Price | Buy |
|---|
| Part Number | LQFP44 |
| Manufacturer | Philips |
| Title | PC board footprint |
| Description | Philips Semiconductors PC board footprint Footprint information for reflow soldering of LQFP44 package SOT389-1 Hx Gx P2 P1 (0.125) Hy Gy By Ay C D2 (8×) Bx Ax Generic footprint pattern D1 Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm. |
| Features | . |
| Part Number | LQFP44 |
| Manufacturer | ETC |
| Title | SMD Adapter Board |
| Description | The PCB-TQFP44 adapter module is designed to convert integrated circuits (IC) in 44-pin QFP/LQFP/TQFP packages to a top mounted module. This adapter was designed for engineers, students and hobbyists who are looking for a quick way of connect surface mount components to the breadboard. Features . |
| Features |
SMD/SMT QFP44/LQFP44/TQFP44 packages with 10x10mm body size and 0.8mm pitch Double rows standard 2.54mm pitch header pins (drill 0.8mm) Small and compact in size 41x41mm Board thickness 1.2mm White marking print High quality FR4 material Copper final thickness 35µm Green solder-stop on both sides HAL lead-free surface Electrical test Package Information D E B2 B1 D2 D1 D2 . |
| Part Number | LQFP44 |
| Manufacturer | Philips |
| Title | Package outline |
| Description | PDF: 2002 Jun 07 Philips Semiconductors Package outline LQFP44: plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm SOT389-1 c y X A 33 34 23 22 ZE e E HE w M bp 44 1 bp D HD w M 11 ZD B v M B v M A 12 detail X L Lp A A2 A1 pin 1 index (A 3) θ e 0 2.5 scale 5 mm DIMEN. |
| Features | . |
similar datasheet
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | LQFP44-1010 |
Holtek |
Package |
|
| 2 | LQFP48 |
Holtek |
48-pin LQFP (7mm x 7mm) Outline Dimensions |
|
| 3 | LQFP48 |
ETC |
Package |
|
| 4 | LQFP48 |
Philips |
Package outline |
|
| 5 | LQFP-64 |
Infineon |
Package Outline |
|
| 6 | LQFP-64 |
i2Chip |
Pin Assignment |
|
| 7 | LQFP100 |
NXP |
plastic low profile quad flat package |
|
| 8 | LQFP128 |
Actions |
Single-chip highly-integrated digital music |
|
| 9 | LQFP128-P-1420-0.50 |
ETC |
LQFP128-P-1420-0.50 |
|
| 10 | LQFP128-P-1818E |
ETC |
LQFP128-P-1818E |
|
Desde 2024. D4U Semiconductor.
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