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LGA672 High-Current LED

LGA672

LGA672
LGA672 LGA672
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Part Number LGA672
Manufacturer OSRAM
Description Super SIDELED® High-Current LED LG A672, LP A672 Abgekündigt nach PD_078_02 - werden durch LG A676 und LP A676 ersetzt werden Obsolete acc. to PD_078_02 - will be replaced by LG A676 and LP A676 Besondere Merkmale • Gehäusetyp: weißes SMT Gehäuse • Besonderheit des Bauteils: Abstrahlung parallel zur Platine, deshalb ideal zur Einkopplung in Lichtleiter; hö.
Features
• package: white SMT package
• feature of the device: radiation direction parallel to PCB, so an ideal LED for coupling in light guides; higher permissible current
• wavelength: 570 nm (green), 560 nm (pure green)
• viewing angle: Lambertian Emitter (120°)
• technology: GaAsP (green), GaP (pure green)
• optical efficiency: 1.5 lm/W (green), 0.6 lm/W (pure green)
• grouping parameter: luminous intensity
• assembly methods: suitable for all SMT assembly methods
• soldering methods: IR reflow soldering and TTW soldering
• preconditioning: acc. to JEDEC Level 2
• taping: 12 mm tape with 2000/reel,.
Datasheet Datasheet LGA672 Data Sheet
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LGA672

Siemens
LGA672
Part Number LGA672
Manufacturer Siemens
Title Super SIDELED High-Current LED
Description Super SIDELED® High-Current LED LS A672, LO A672, LY A672 LG A672, LP A672 VPL06880 Besondere Merkmale q Gehäusefarbe: weiß q als optischer Indikator einsetzbar q besonders geeignet bei hohem Umgebungslicht durch erhöhten Betriebsstrom (≤ 50 mA DC) q zur Hinterleuchtung, Lichtleiter- und Linsenei.
Features q color of package: white q for use as optical indicator q appropriate for high ambient light because of the higher operating current (≤ 50 mA DC) q for backlighting, optical coupling into light pipes and lenses q suitable for all SMT assembly and reflow soldering methods q available taped on reel (12 mm tape) q load dump resistant acc. to DIN 40839 Semiconductor Group 1 1998-11-12 LS A672, LO.


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