ESD5581 |
Part Number | ESD5581 |
Manufacturer | ON Semiconductor (https://www.onsemi.com/) |
Description | of survivability specs. © Semiconductor Components Industries, LLC, 2017 1 July, 2024 − Rev. 10 Publication Order Number: ESD5581/D ESD5581 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage . |
Features |
• Low Clamping Voltage • Small Body Outline Dimensions: 0.62 mm x 0.32 mm • Low Body Height: 0.3 mm • Stand−off Voltage: 5 V • IEC61000−4−2 Level 4 ESD Protection • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • mSD Card Protection • Audio Line Protection • GPIO MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Air ±30 kV ±30 Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Thermal Resistance, Junction−to−Ambient Junction and Storage Temperature Range Lead Solder Temperature − Maximum (10 Second Duration) . |
Datasheet |
ESD5581 Data Sheet
PDF 319.44KB |
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