BAV19 |
Part Number | BAV19 |
Manufacturer | Taiwan Semiconductor |
Description | Multiple manufacture source Halogen free Define manufacture source Halogen free PACKAGE OUTLINE DIMENSION DIM. A B C D Unit (mm) Min Max 0.34 0.60 2.90 5.08 25.40 38.10 1.30 2.28 Unit (inch) Min M... |
Features |
- Fast switching device (trr<4.0ns) - Through-hole device type mounting - Hermetically sealed glasss - Solder hot dip tin (Sn) lead finish - All external surfaces are corrosion resistant and
leads are readily solderable - Packing code with suffix "G" means
Halogen free
MECHANICAL DATA
- Case: DO-35 package - High temperature soldering guaranteed: 260oC/10s - Polarity: Indicated by black cathode band - Weight: 109 ± 4 mg
DO-35 Hermetically Sealed Glass
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25oC unless otherwise noted)
PARAMETER
SYMBOL
VALUE
Power Dissipation
Peak Forward Surg... |
Document |
BAV19 Data Sheet
PDF 190.07KB |
Distributor | Stock | Price | Buy |
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No. | Parte # | Fabricante | Descripción | Hoja de Datos |
---|---|---|---|---|
1 | BAV10 |
NXP |
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2 | BAV100 |
NXP |
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3 | BAV100 |
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4 | BAV100 |
General Semiconductor |
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5 | BAV100 |
Kingtronics |
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6 | BAV100 |
Taiwan Semiconductor |
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7 | BAV100 |
MCC |
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8 | BAV100 |
CDIL |
HIGH SPEED SILICON DIODES | |
9 | BAV100 |
SeCoS |
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10 | BAV100 |
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