ISP1040B |
Part Number | ISP1040B |
Manufacturer | Qlogic |
Description | Assembly Die Process and Design ANALYSIS RESULTS I Assembly ANALYSIS RESULTS II Die Process and Design ANALYSIS PROCEDURE PAGE 1 1 2 2-3 4 5-7 8 TABLES Overall Evaluation Package Markings Wirebon... |
Features |
• Three metal, twin-well CMOS process. • Sub-micron gate lengths (0.5 micron). 1These items present possible quality or reliability concerns. They should be discussed with the manufacturer to determine their possible impact on the intended application. -1- TECHNOLOGY DESCRIPTION Assembly: • Devices were packaged in 208-pin Plastic Quad Flat Packs (PQFPs). • Copper (Cu) gull-wing leadframe tinned with tin-lead (SnPb) solder. • Dimpled paddle for added package strength, paddle was seated on a heat-spreader (Al). Paddle was attached to the heatspreader by a thermal adhesion. Heatspreader was... |
Document |
ISP1040B Data Sheet
PDF 1.80MB |
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