STB8NC50 |
Part Number | STB8NC50 |
Manufacturer | STMicroelectronics (https://www.st.com/) |
Description | The PowerMESH™II is the evolution of the first generation of MESH OVERLAY™. The layout refinements introduced greatly improve the Ron*area figure of merit while keeping the device at the leading edge ... |
Features |
rain Current (pulsed) Total Dissipation at TC = 25°C Derating Factor Peak Diode Recovery voltage slope Storage Temperature Max. Operating Junction Temperature Value 500 500 ±30 8 5.4 32 135 1 3 –65 to 150 150 Unit V V V A A A W W/°C V/ns °C °C ( •)Pulse width limited by safe operating area (1)ISD ≤8A, di/dt ≤300A/µs, VDD ≤ V (BR)DSS, T j ≤ T JMAX. November 2001 1/9 www.DataSheet.in STB8NC50 THERMAL DATA Rthj-case Rthj-amb Tl Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max Maximum Lead Temperature For Soldering Purpose 0.93 62.5 300 °C/W °C/W °C AVALANCHE CHARA... |
Document |
STB8NC50 Data Sheet
PDF 369.23KB |
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