Busque con el número de pieza junto con el fabricante o la descripción
MPC8200 |
Click to view a larger image
| Part Number | MPC8200 |
| Manufacturer | Microsemi (https://www.microsemi.com/) |
| Description | KEY FEATURES Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical Surface Mount design Broadband Performance through X-Band Available on Tape & Reel for automated pick & place assembly Sm... |
| Features |
Low parasitics LP = 0.02nH Typical CP = 0.04pF Typical Surface Mount design Broadband Performance through X-Band Available on Tape & Reel for automated pick & place assembly Small, SOD 323 Footprint This series of surface mount capacitors utilize new and unique monolithic MMSM® technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics provide smooth non-resonant functiona... |
| Document |
 MPC8200 Data Sheet
PDF 433.00KB |
Similar Datasheet
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | MPC821 |
Freescale Semiconductor |
PowerPC Personal Syetems Microprocessor |
|
| 2 | MPC823 |
Motorola |
AC Electrical Specifications |
|
| 3 | MPC8240EC |
Motorola |
microprocessor |
|
| 4 | MPC8241 |
Freescale Semiconductor |
Intergrated Processor |
|
| 5 | MPC8245 |
Freescale |
Integrated Processor |
|
| 6 | MPC8248 |
Motorola |
MPC8272 PowerQUICC II Family Hardware Specifications |
|
Desde 2024. D4U Semiconductor.
|