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FCSP05H40TR |
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| Part Number | FCSP05H40TR |
| Manufacturer | Vishay (https://www.vishay.com/) Siliconix |
| Description | Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can del... |
| Features |
• Ultra low VF to footprint area • Very low profile (< 0.6 mm) • Low thermal resistance • Supplied tested and on tape and reel RoHS COMPLIANT APPLICATIONS • Reverse polarity protection • Current steering • Freewheeling FlipKY® • Flyback • Oring DESCRIPTION Vishay's FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side o... |
| Document |
 FCSP05H40TR Data Sheet
PDF 128.21KB |
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | FCSP05H40ETR |
Vishay Siliconix |
chip scale packaging to deliver Schottky diodes |
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| 2 | FCSP0530ETR |
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chip scale packaging to deliver Schottky diodes |
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| 3 | FCSP0530TR |
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| 4 | FCSP0730TR |
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| 5 | FCSP07H40TR |
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| 6 | FCSP130ETR |
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Desde 2024. D4U Semiconductor.
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