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FCSP0530ETR |
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| Part Number | FCSP0530ETR |
| Manufacturer | Vishay (https://www.vishay.com/) Siliconix |
| Description | FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver ... |
| Features |
• • • • • Ultralow VF to footprint area Very low profile (< 0.6 mm ) Low thermal resistance Supplied tested and on tape and reel Designed for consumer level APPLICATIONS • • • • • Reverse polarity protection Current steering Freewheeling Flyback Oring FlipKY® DESCRIPTION FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on o... |
| Document |
 FCSP0530ETR Data Sheet
PDF 119.19KB |
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | FCSP0530TR |
Vishay Siliconix |
Chip Scale Package Schottky Barrier Rectifier |
|
| 2 | FCSP05H40ETR |
Vishay Siliconix |
chip scale packaging to deliver Schottky diodes |
|
| 3 | FCSP05H40TR |
Vishay Siliconix |
Chip Scale Package Schottky Barrier Rectifier |
|
| 4 | FCSP0730TR |
Vishay Siliconix |
Chip Scale Package Schottky Barrier Rectifier |
|
| 5 | FCSP07H40TR |
Vishay Siliconix |
Chip Scale Package Schottky Barrier Rectifier |
|
| 6 | FCSP130ETR |
Vishay Siliconix |
Chip Scale Package Schottky Barrier Rectifier |
|
Desde 2024. D4U Semiconductor.
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