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A82DL1624T |
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| Part Number | A82DL1624T |
| Manufacturer | AMIC Technology |
| Description | The A82DL16x2T(U) family consists of 16 megabit, 3.0 voltonly flash memory devices, organized as 1,048,576 words of 16 bits each or 2,097,152 bytes of 8 bits each. Word mode data appears on I/O0–I/O15... |
| Features |
Single power supply operation 2.7 to 3.6 volt High Performance - Access time as fast as 70ns Package 69-Ball TFBGA (8x11x1.4 mm) Industrial operating temperature range: -40°C to 85°C for –U; -25°C to 85°C for –I - Suspends erase operations to allow programming in same bank Data Polling and Toggle Bit - Provides a software method of detecting the status of program or erase cycles Unlock Bypass Program command - Reduces overall programming time when issuing multiple program command sequences HARDWARE FEATURES Any combination of sectors can be erased Ready/ Busy output (RY/ BY ) - Hardware method... |
| Document |
 A82DL1624T Data Sheet
PDF 976.48KB |
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | A82DL1624U |
AMIC Technology |
(A82DL16x4U) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
|
| 2 | A82DL1622T |
AMIC Technology |
(A82DL16x2T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
|
| 3 | A82DL1622U |
AMIC Technology |
(A82DL16x2U) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
|
| 4 | A82DL1632T |
AMIC Technology |
(A82DL16x2T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
|
| 5 | A82DL1632U |
AMIC Technology |
(A82DL16x2U) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
|
| 6 | A82DL1634T |
AMIC Technology |
(A82DL16x4T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
|
Desde 2024. D4U Semiconductor.
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