IR0530CSP |
Part Number | IR0530CSP |
Manufacturer | International Rectifier |
Description | International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm d... |
Features |
• Ultra Low VF To Footprint Area • • • Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel Applications • Reverse Polarity Protection • • • • Current Steering Freewheeling Flyback Oring FlipKYTM Major Ratings and Characteristics Characteristics IF(AV) Rectangular waveform VRRM IFSM @ tp = 5 µs sine VF TJ @ 0.5 Apk, TJ=125°C range IR0530CSP 0.5 30 190 0.33 - 55 to 150 Units A V A V °C Description International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in in... |
Document |
IR0530CSP Data Sheet
PDF 189.69KB |
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