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DT8C01 |
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| Part Number | DT8C01 |
| Manufacturer | Diotec Semiconductor |
| Description | www.DataSheet4U.com DIOTEC ELECTRONICS CORP. Y`3a3b'adcfe'gh¤ i pCqr stvu wyxX3 pq 5 6¤8 9"@'A6CB¢DFEHG"I3PQ¤RTSVU WXU E 7 ¢¡¤£ ¥ ¦¨§ ©¢¤¢ "!#%$'&('¦)§ ©0'1323... |
| Features |
MECHANICAL SPECIFICATION
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area) BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
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SYM A B B1 B2 B3 C C1 C2 D D1 D2 D3 D4 MILLIMETERS MIN 2.5 0.6 7.3 9.8 0.9 29.7 3.6 4.4 19.7 13.2 3.8 10.8 3.1 MAX 2.9 0.8 7.7 10.2 1.1 30.3 4.0 4.8 20.3 13.8 4.2 11.2 3.3
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SURGE OVERLOAD RATING TO 400 AMPS PEAK THRU-HOLE FOR EASY HEAT SINK MOUNTING
UL RECOGNIZED - FILE #E124962 RoHS COMPLIANT
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| Document |
 DT8C01 Data Sheet
PDF 347.43KB |
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Desde 2024. D4U Semiconductor.
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