SIGC158T170R3 |
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Part Number | SIGC158T170R3 |
Manufacturer | Infineon (https://www.infineon.com/) Technologies |
Description | AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG, Bere... |
Features |
• 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling 3 This chip is used for: • power module C Applications: • drives G E Chip Type SIGC158T170R3 VCE ICn Die Size 12.57 x 12.57 mm2 Package sawn on foil Ordering Code Q67050A4227-A101 1700V 125A MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recom... |
Datasheet |
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