SIGC158T170R3 Infineon Technologies IGBT

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SIGC158T170R3

Infineon Technologies
SIGC158T170R3
SIGC158T170R3 SIGC158T170R3
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Part Number SIGC158T170R3
Manufacturer Infineon (https://www.infineon.com/) Technologies
Description AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG, Bere...
Features
• 1700V Trench + Field Stop technology
• low turn-off losses
• short tail current
• positive temperature coefficient
• easy paralleling 3 This chip is used for:
• power module C Applications:
• drives G E Chip Type SIGC158T170R3 VCE ICn Die Size 12.57 x 12.57 mm2 Package sawn on foil Ordering Code Q67050A4227-A101 1700V 125A MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recom...

Datasheet Datasheet SIGC158T170R3 Data Sheet
PDF 95.42KB


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