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LPS200 |
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| Part Number | LPS200 |
| Manufacturer | Filtronic Compound Semiconductors |
| Title | HIGH PERFORMANCE LOW NOISE PHEMT |
| Features |
♦ 1.0 dB Noise Figure at 18 GHz ♦ 10 dB Associated Gain at 18 GHz ♦ Low DC Power Consumption
LPS200
GATE BOND PAD (2X) SOURCE BOND PAD (2x)
DRAIN BOND PAD (2X)
DIE SIZE: 12.6X10.2mils (320x260 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.3X2.6 mils (85x65 µm)
• DESCRIPTION AND APPLICAT... |
| Document |
 LPS200 Data Sheet
PDF 29.79KB |
Similar Datasheet
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Desde 2024. D4U Semiconductor.
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