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AN241 |
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| Part Number | AN241 |
| Manufacturer | Philips |
| Description | Philips Semiconductors Advanced BiCMOS Products Application note Thermal considerations for advanced logic families (Futurebus+, ABT and MULTIBYTE) AN241 INTRODUCTION Thermal characteristics of in... |
| Features |
uch smaller, but the thermal energy is concentrated more densely on the printed wiring board. For these reasons, designers and manufacturers of surface mount assemblies must be aware of all the variables affecting TJ.
There are five major factors controlled by the user which contribute to increased BiCMOS power dissipation. 1. Frequency of operation (output switching frequency) 2. Input voltage levels 3. Output loading (capacitive and resistive) 4. VCC level
POWER DISSIPATION
Power dissipation for the ABT (Advanced BiCMOS Technology), MULTIBYTE and Futurebus+ devices can be estimated using t... |
| Document |
 AN241 Data Sheet
PDF 121.83KB |
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