Busque con el número de pieza junto con el fabricante o la descripción
MA4BPS201 |
Click to view a larger image
| Part Number | MA4BPS201 |
| Manufacturer | Tyco |
| Description | These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process. They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond p... |
| Features |
• • • • • Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Passivation Polyimide Scratch Protection Chip Layout Description These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process. They contain a single shunt silicon PIN diode embedded in a glass substrate with dual 75 x 150 micron bond pads located near the chip edges. The large pads allow use of multiple bond wires. The location of these pads on a glass substrate results in low parasitic capacitance. The diode junction is ... |
| Document |
 MA4BPS201 Data Sheet
PDF 83.95KB |
Similar Datasheet
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | MA4BPS101 |
Tyco |
PIN Diode Chips with Offset Bond Pads |
|
| 2 | MA4BPS301 |
Tyco |
PIN Diode Chips with Offset Bond Pads |
|
| 3 | MA4BN1840-1 |
Tyco Electronics |
Monolithic HMIC Integrated Network |
|
| 4 | MA4BN1840-2 |
Tyco Electronics |
Monolithic HMIC Integrated Dual Bias Network |
|
| 5 | MA4000 |
Panasonic |
Silicon planar type |
|
| 6 | MA4000N |
Panasonic Semiconductor |
Silicon planar type |
|
Desde 2024. D4U Semiconductor.
|