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US1G |
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| Part Number | US1G |
| Manufacturer | NXP (https://www.nxp.com/) |
| Description | DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads. cat... |
| Features |
• Glass passivated • High maximum operating temperature • Ideal for surface mount automotive applications • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • UL 94V-O classified plastic package • Shipped in 12 mm embossed tape • Marking: cathode, date code, type code • Easy pick and place. olumns US1 series DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads. cathode band k a Top view Side vi... |
| Document |
 US1G Data Sheet
PDF 66.55KB |
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Desde 2024. D4U Semiconductor.
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