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IXTM24N50 |
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| Part Number | IXTM24N50 |
| Manufacturer | IXYS Corporation |
| Title | MOSFET |
| Features |
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Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
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International standard packages Low RDS (on) HDMOSTM process Rugged polysilicon gate cell structure Low package inductance (< 5 nH) - easy to drive and to protect Fast switching times
Symbol
Test Conditions
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| Document |
 IXTM24N50 Data Sheet
PDF 107.40KB |
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