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8S2TH06I |
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| Part Number | 8S2TH06I |
| Manufacturer | Thinki Semiconductor |
| Description | 8S2TH02I thru 8S2TH06I ® Pb Free Plating Product 8S2TH02I/8S2TH04I/8S2TH06I Pb 16.0 Ampere Ceramic Insulated Dual Series Connection Ultra Fast Recovery Rectifiers Features Latest FRED technology... |
| Features |
Latest FRED technology with super fast recovery time Low forward voltage drop High current capability Low reverse leakage current High surge current capability
Application
Automotive Inverters and Solar Inverters Plating Power Supply,SMPS,Motor Control and UPS Car Audio Amplifiers and Sound Device Systems
Mechanical Data Case: TO-220AC heatsink with inner ceramic insulated Epoxy: UL 94V-0 rate flame retardant Terminals: Solderable per MIL-STD-202 method 208 Polarity: As marked on diode body Mounting position: Any Weight: 2.0 gram approximately
TO-220AC
.419(10.66) .387(9.85)
.139(3.55) MIN
... |
| Document |
 8S2TH06I Data Sheet
PDF 727.68KB |
| Distributor | Stock | Price | Buy |
|---|
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | 8S2TH02I |
Thinki Semiconductor |
16.0 Ampere Ceramic Insulated Dual Series Connection Ultra Fast Recovery Rectifiers |
|
| 2 | 8S2TH04I |
Thinki Semiconductor |
16.0 Ampere Ceramic Insulated Dual Series Connection Ultra Fast Recovery Rectifiers |
|
| 3 | 8S003F3 |
STMicroelectronics |
8-bit MCU |
|
| 4 | 8S003F3P6 |
STMicroelectronics |
8-bit MCU |
|
| 5 | 8S003K3 |
STMicroelectronics |
STM8S003K3 |
|
| 6 | 8S650GXM |
GIGABYTE |
Motherboard Manual |
|
| 7 | 8S89296 |
Renesas |
LVDS Programmable Delay Line |
|
| 8 | 8S89831I |
IDT |
Differential LVPECL-To-LVPECL/ECL Fanout Buffer |
|
| 9 | 8S89831I |
Renesas |
Differential LVPECL-To-LVPECL/ECL Fanout Buffer |
|
| 10 | 8S89832I |
Renesas |
1-to-4 Differential-to-LVDS Fanout Buffer |
|
Desde 2024. D4U Semiconductor.
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