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SH68N65DM6AG |
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| Part Number | SH68N65DM6AG |
| Manufacturer | STMicroelectronics (https://www.st.com/) |
| Description | This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the AC... |
| Features |
Order code SH68N65DM6AG
VDS 650 V
RDS(on) max. 41 mΩ
ID 64 A
• AQG 324 qualified • Half-bridge power module • 650 V blocking voltage • Fast recovery body diode • Very low switching energies • Low package inductance • Dice on direct bond copper (DBC) substrate • Low thermal resistance • Isolation rating of 3.4 kVrms/min Applications • Switching applications Description This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers... |
| Document |
 SH68N65DM6AG Data Sheet
PDF 550.48KB |
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Desde 2024. D4U Semiconductor.
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