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C470UT170 |
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| Part Number | C470UT170 |
| Manufacturer | CREE |
| Description | P-N Junction Area (μm) Chip Top Area (μm) Chip Thickness (μm) Chip Bottom Area (μm) Au Bond Pad Diameter (μm) Bonding Area Diameter (μm) Note 5 Au Bond Pad Thickness (μm) Backside Contact Metal Area (... |
| Features |
• Small Chip – 170 x 170 x 50 μm • Single Wire Bond Structure • UT LED Performance – 450 nm – 12+ mW – 460 nm – 10+ mW – 470 nm – 10+ mW – 527 nm – 4+ mW • Low Forward Voltage – 2.9 V Typical at 5 mA • 2kV Class 2 ESD Rating APPLICATIONS • Indicator Applications – Consumer Products – Mobile Devices – Product Displays – White Goods • Automotive Applications – Interior Indicators – Meter Cluster Lighting – Center Stack Displays CxxxUT170-Sxxxx-31 Chip Diagram Top View Anode (+), Ф85 µm (Bonding area, Ф70 µm) Junction, 140 x 140 µm Thickness 50 µm Side View 170 x 170 µm Bottom Surface 130 ... |
| Document |
 C470UT170 Data Sheet
PDF 263.03KB |
| Distributor | Stock | Price | Buy |
|---|
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | C470UT190 |
CREE |
LED |
|
| 2 | C4700 |
Vectron International |
OCXO Ultra-High Stability Excellent Temperature Stability SC-Cut Crystal Crystal |
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| 3 | C4704 |
Hitachi Semiconductor |
Silicon NPN Epitaxial |
|
| 4 | C4705 |
Sanyo |
2SC4705 |
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| 5 | C4706 |
Sanken electric |
2SC4706 |
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| 6 | C470IP |
VOIP |
Providing Professional Solutions |
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| 7 | C470IP |
Gigaset |
Review |
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| 8 | C4710 |
Sanyo |
2SC4710 |
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| 9 | C4714 |
Panasonic |
NPN Transistor |
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| 10 | C4727 |
Sanyo |
2SC4727 |
|
Desde 2024. D4U Semiconductor.
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