W25Q32JWTCIM |
Part Number | W25Q32JWTCIM |
Manufacturer | Winbond |
Description | .. 4 2. FEATURES ..... |
Features |
... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS . 5
3.1 Pin Configuration SOIC 150-mil / 208-mil ... 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ..... 5 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm . 5 3.4 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball... |
Document |
W25Q32JWTCIM Data Sheet
PDF 1.84MB |
No. | Parte # | Fabricante | Descripción | Hoja de Datos |
---|---|---|---|---|
1 | W25Q32JWTCIQ |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY | |
2 | W25Q32JWTBIM |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY | |
3 | W25Q32JWTBIQ |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY | |
4 | W25Q32JW |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY | |
5 | W25Q32JWBYIM |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY | |
6 | W25Q32JWBYIQ |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY |