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W25Q32JWXGIM |
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| Part Number | W25Q32JWXGIM |
| Manufacturer | Winbond |
| Description | .. 4 2. FEATURES ..... |
| Features |
... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS . 5
3.1 Pin Configuration SOIC 150-mil / 208-mil ... 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm ..... 5 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, XSON 4x4-mm, USON4x3-mm . 5 3.4 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball... |
| Document |
 W25Q32JWXGIM Data Sheet
PDF 1.84MB |
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | W25Q32JWXGIQ |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY |
|
| 2 | W25Q32JW |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY |
|
| 3 | W25Q32JWBYIM |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY |
|
| 4 | W25Q32JWBYIQ |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY |
|
| 5 | W25Q32JWSNIM |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY |
|
| 6 | W25Q32JWSNIQ |
Winbond |
1.8V 32M-BIT SERIAL FLASH MEMORY |
|
Desde 2024. D4U Semiconductor.
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