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W25Q80EWZPIG |
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| Part Number | W25Q80EWZPIG |
| Manufacturer | Winbond |
| Description | . 5 2. FEATURES ....... |
| Features |
.. 5 3. PACKAGE TYPES: .... 6
3.1 Pin Configuration SOIC 150/208-mil AND VSOP 150-mil ... 6 3.2 PAD Configuration WSON 6x5-MM AND USON 2x3-mm .. 6 3.3 Pin Description SOIC150/208-mil, VSOP 150-mil, WSON 6x5-MM,USON 2x3 .... 6 3.4 Ball C... |
| Document |
 W25Q80EWZPIG Data Sheet
PDF 1.54MB |
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | W25Q80EWZPIQ |
Winbond |
1.8V 8M-BIT SERIAL FLASH MEMORY |
|
| 2 | W25Q80EW |
Winbond |
1.8V 8M-BIT SERIAL FLASH MEMORY |
|
| 3 | W25Q80EWBYIG |
Winbond |
1.8V 8M-BIT SERIAL FLASH MEMORY |
|
| 4 | W25Q80EWSNIG |
Winbond |
1.8V 8M-BIT SERIAL FLASH MEMORY |
|
| 5 | W25Q80EWSNIQ |
Winbond |
1.8V 8M-BIT SERIAL FLASH MEMORY |
|
| 6 | W25Q80EWSSIG |
Winbond |
1.8V 8M-BIT SERIAL FLASH MEMORY |
|
Desde 2024. D4U Semiconductor.
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