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W25Q32JVXGIM |
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| Part Number | W25Q32JVXGIM |
| Manufacturer | Winbond |
| Description | . 4 2. FEATURES........ |
| Features |
. 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 5
3.1 Pin Configuration SOIC 208-mil 5 3.2 Pad Configuration WSON 6x5-mm, XSON 4x4-mm .... 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm, XSON 4x4-mm ...... 5 3.4 ... |
| Document |
 W25Q32JVXGIM Data Sheet
PDF 3.13MB |
| No. | Parte # | Fabricante | Descripción | Hoja de Datos |
|---|---|---|---|---|
| 1 | W25Q32JV |
Winbond |
3V 32M-BIT SERIAL FLASH MEMORY |
|
| 2 | W25Q32JV-DTR |
Winbond |
3V 32M-BIT SERIAL FLASH MEMORY |
|
| 3 | W25Q32JVSFIM |
Winbond |
3V 32M-BIT SERIAL FLASH MEMORY |
|
| 4 | W25Q32JVSSIM |
Winbond |
3V 32M-BIT SERIAL FLASH MEMORY |
|
| 5 | W25Q32JVTBIM |
Winbond |
3V 32M-BIT SERIAL FLASH MEMORY |
|
| 6 | W25Q32JVTCIM |
Winbond |
3V 32M-BIT SERIAL FLASH MEMORY |
|
Desde 2024. D4U Semiconductor.
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