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BY505 |
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| Part Number | BY505 |
| Manufacturer | NXP (https://www.nxp.com/) |
| Description | Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of a MAM162 Fig.1 Simplified outline (SOD61A) and symbol. ... |
| Features |
• Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Soft-recovery switching characteristics • Compact construction. APPLICATIONS • High-voltage applications for: – High frequencies – Switching applications. The cathode lead is marked by a black band. k handbook, halfpage BY505 expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas. DESCRIPTION Rugged glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as co... |
| Document |
 BY505 Data Sheet
PDF 32.30KB |
Similar Datasheet
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Desde 2024. D4U Semiconductor.
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