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BZG04-180 |
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| Part Number | BZG04-180 |
| Manufacturer | NXP (https://www.nxp.com/) |
| Description | DO-214AC surface mountable package with glass passivated chip. BZG04 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic. handbook, 4 columns Fig.1 Simplified out... |
| Features |
• Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • UL 94V-O classified plastic package • Transient suppressor stand-off voltage range: 8.2 to 220 V for 32 types • Shipped in 12 mm embossed tape. DESCRIPTION DO-214AC surface mountable package with glass passivated chip. BZG04 series The well-defined void-free case is of a transfer-moulded thermo-setting plastic. handbook, 4 columns Fig.1 Simplified outline (DO-214AC; SOD106) and symbol. ,, ,, ,, k cathode band a Top view Side view MSA473 LIMITING VALUES In accordance with the Absolute ... |
| Document |
 BZG04-180 Data Sheet
PDF 31.79KB |
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