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BYX133GL |
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| Part Number | BYX133GL |
| Manufacturer | NXP (https://www.nxp.com/) |
| Description | Rugged glass package, using a high temperature alloyed construction. The SOD119AB is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is des... |
| Features |
• Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability. APPLICATIONS • Car ignition systems • Automotive applications with extreme temperature requirements. handbook, k halfpage BYX133GL DESCRIPTION Rugged glass package, using a high temperature alloyed construction. The SOD119AB is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas. a MAM420 Cathode indicated by... |
| Document |
 BYX133GL Data Sheet
PDF 37.00KB |
Similar Datasheet
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| 1 | BYX133G |
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| 2 | BYX133GPL |
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| 5 | BYX134G |
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Desde 2024. D4U Semiconductor.
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