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BYM26C |
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| Part Number | BYM26C |
| Manufacturer | NXP (https://www.nxp.com/) |
| Description | Rugged glass SOD64 package, using a high temperature alloyed BYM26 series construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched... |
| Features |
• Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • Available in ammo-pack • Also available with preformed leads for easy insertion. DESCRIPTION Rugged glass SOD64 package, using a high temperature alloyed BYM26 series construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) Fig.1 Simplified outline (SOD64) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134).... |
| Document |
 BYM26C Data Sheet
PDF 70.24KB |
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Desde 2024. D4U Semiconductor.
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